FERMADUR
Two-component polyurethane potting compounds
Tailor-made chemistry for your electronic components.
FERMADUR is the trade name for Sonderhoff’s two- component polyurethane systems for the manufacture of hard to gel-like potting compounds which are placed and cured directly onto or into the component using FIP (Formed-in-Place) technology. The systems consist of a resin basis (A-component) and a hardener (B-component) which are mixed together in a prescribed ratio, forming a bubble-free potting compound after only a few minutes. The function of the potting compound is determined by the application and uses range from surface coating to protect against environmental effects, to encapsulating electronic components or gluing components. The flowability, reactivity, hardness classification and colour of the components can be adjusted as required.
10 good reasons for using FERMADUR:
- FERMADUR systems are the most suitable for sealing industrial components
- After curing, FERMADUR systems develop a crosslinked structure which is extremely resistant to environmental effects, such as humidity, dust, temperature and mechanical impacts
- FERMADUR systems react at room temperature in 1 – 180 min and although a furnance can reduce the reaction time considerably, it is not a necessity
- FERMADUR systems achieve particularly good adhesion to parts due to the chemical reaction of the two components on the carrier material
- FERMADUR systems offer exceptional long-term behaviour and are distinguished by high heat resistance and an extremely low expansion coefficient
- The viscosity of FERMADUR systems can be regulated from a thin fluid to a thick paste
- FERMADUR systems are also available in transparent and light-fast formulations
- FERMADUR systems have low shrinkage and low surface tension, very good dielectric properties and also very high impact strength
- Processing machines for FERMADUR systems can be adapted flexibly and quickly to other components at any time
- By using FERMADUR systems even small product series become profitable
Processing information
Fermadur systems are processed using 2-component mixing and dosing machines. The recommended processing temperature is 23 °C ± 5 °C at a relative humidity between 40 and 70 %. Most Fermadur components can be stored in the original packaging at a temperature between + 10 °C and + 40 °C for at least 6 months.
Physical and chemical properties
Properties | FERMADUR |
Appearance | black or grey, other colours upon request (including transparent) |
Hardness | covering the entire Shore A range up to 80 Shore D also gel-like |
Density | from 0.8 g/cm³ to 1.7 g/cm³ |
Reaction time | adjustable from 60 s to 180 min |
Flame retardant | flame retardant up to UL-94 V-0 possible, even with 2 mm coating thickness |
Other properties | e.g. transparent, light-fast, with good thermal conductivity, can be used for rotation moulding, dissipates static, hydrophobic, also available as a syntactic foam, with multilevel flow behaviour, treated with microbicide, abrasion resistant, greater adhesion |
FERMADUR | Applications | Viscosity (A) | Hardness | Density | Other properties |
A-610 | Potting compound for sensitive electronic components, circuit boards and sensors | ca. 2.000 | gel-like | 1,20 | Consistency adjustable across the range of mixing ratios, soft and tear resistant |
A-113 | Potting compound for instrument and connector plugs | ca. 1.000 | A45-A55 | 1,15 | Flexible, levels very well, low shrinkage, low surface tension |
A-606 | Special potting compound for electronic components | ca. 1.200 | A45-A60 | 1,20 | Flexible, mechanically particularly stable, tensile strength approx. 7 Mpa, elongation at break approx. 350% |
A-134 | Potting compound for sensors, circuit boards, electric switches and sensor elements | ca. 1.800 | A60-A75 | 1,35 | Flexible standard systems for electronics in the automotive industry, listed in various OEMs, good adhesion |
A-125 | Potting compound for plugs | ca. 1.500 | A65-A75 | 1,20 | Flexible potting compound, low shrinkage, low surface tension |
A-203 | Potting compound for transistors | ca. 1.200 | A60-A80 | 1,20 | Flexible, for sensitive electronic applications, low shrinkage, low surface tension |
A-680 UL2 | Potting compound for sensors and circuit boards | ca. 7.000 | A65-A80 | 1,60 | Conforms to UL94 V-0 listing at 2 mm, elastic |
A-690 UL1 | UL94 listed potting compound for transducers | ca. 6.000 | D80-D85 | 1,60 | UL94 V-0 listing at 1.5 mm, hard, good thermal conductivity |
A-117 | Potting compound for transformers, voltage | ca. 23.000 | D60-D90 | 1,70 | Hard, thermal conductivity 0.9 W/mK, conforms to UL94 V-0 at 3 mm |
A-111 | Potting compound for sensors or circuit boards | ca. 300 | gel-like | 1,25 | Transparent, soft to gel-like, for sensitive electronic applications |
A-180 | Potting compound for light diodes | ca. 500 | A60-A80 | 1,25 | Transparent, UV stable, tough-hard, temperature stable up to 165°C, high chemical resistance |
A-173 | Potting compound for cable sheathing or moulded parts for cable routing | ca. 1.000 | A50 | 0,80 | Slightly foaming, flexible, high longitudinal water tightness achievable |
A-120 | Adhesive for panes in enclosures | ca. 200.000 | D25-D40 | 1,30 | Tough-hard, good adherence on various substrates, high mechanical stability, can be used as a glue, highly thixotropic |
A-187 | Rotation moulding compound for ferrules | ca. 120.000 | D50-D65 | 0,70 | Hard lightweight potting compound, syntactic foam with low density, non-drip |
A-172-2-CON | Rotation moulding compound for ferrules | ca. 250.000 | D80 | 1,40 | Non-drip, high stability and chemical resistances, static dissipative potting compound |
A-640 | Coating for conveyor belts | ca. 23.000 | A70-A80 | 1,25 | Flexible, particularly tear resistant |
A-196-4F | Potting compound for filter end caps and | ca. 1.200 | D30-D40 | 1,20 | Microbicide, tough-hard, good adherence to various substrates, two-step flow behaviour available |
All information in this printed material is based on our current knowledge and experience. Due to the number of possible influences, this information does not exempt processors from carrying out their own tests and trials during the processing and use of the products. A legally binding guarantee of particular properties or suitability of a product for a particular application cannot be inferred from our information.
